When comparing the MediaTek Dimensity 8100 vs Qualcomm Snapdragon 888, it is evident that both processors offer outstanding performance but cater to slightly different needs. The MediaTek Dimensity 8100, announced in March 2022, is built on a 5nm process and features an octa-core setup with ARM Cortex-A78 and Cortex-A55 cores. This configuration delivers a robust balance of power and efficiency, making it a solid choice for high-end smartphones. On the other hand, the Qualcomm Snapdragon 888, unveiled in December 2020, also utilises a 5nm process but includes a unique mix of Cortex-X1, Cortex-A78, and Cortex-A55 cores. This design focuses on delivering maximum performance, especially in tasks demanding high computational power and graphics processing.
For users looking to purchase phones with these powerful processors, there are numerous options available. For instance, those interested in the diverse range of
Snapdragon processor phones can find devices that leverage the advanced capabilities of the Qualcomm Snapdragon 888, particularly for intensive gaming and multitasking. Similarly,
MediaTek processor phones equipped with the Dimensity 8100 offer impressive performance, especially in power efficiency and multimedia capabilities. Both processors support cutting-edge features such as high-resolution cameras, fast download speeds, and superior graphics, making them ideal for tech enthusiasts and everyday users alike. Whether prioritising raw performance or balanced efficiency, the choice between the MediaTek Dimensity 8100 and Qualcomm Snapdragon 888 will depend on the specific needs and preferences of the user.
Technical specifications - MediaTek Dimensity 8100 vs Qualcomm Snapdragon 888
General info
The MediaTek Dimensity 8100 and Qualcomm Snapdragon 888 are high-performance mobile processors used in various smartphones. They were announced in different periods, with distinct target classes and model numbers. Both brands, MediaTek and Qualcomm, are renowned in the semiconductor industry for their advanced chip designs and innovation.
Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
Announced | 01-March-2022 | 01-December-2020 |
Class | High-end | Flagship |
Model number | MT6875 | SM8350 |
Brand | MediaTek | Qualcomm |
CPU
The CPUs of MediaTek Dimensity 8100 and Qualcomm Snapdragon 888 are built on different architectures and processes, catering to high efficiency and performance. The core counts, frequencies, and other attributes significantly impact their processing capabilities and power consumption.
Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
Architecture | ARM Cortex-A78 & A55 | ARM Cortex-X1 & A78 & A55 |
Cores | 8 (4x Cortex-A78, 4x Cortex-A55) | 8 (1x Cortex-X1, 3x Cortex-A78, 4x Cortex-A55) |
Frequency | Up to 2.85 GHz | Up to 2.84 GHz |
Instruction set | ARMv8.2-A | ARMv8.4-A |
Process | 5nm | 5nm |
TDP (Sustained power limit) | 10W | 10W |
Manufacturing | TSMC | Samsung |
Graphics
The graphical capabilities of these SoCs are defined by their GPUs, which vary in architecture, frequency, and other parameters. These specifications determine the performance in gaming, multimedia, and other graphical applications.
Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
SoC | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
GPU name | Mali-G610 MC6 | Adreno 660 |
Architecture | Valhall | Adreno 600 series |
GPU frequency | 850 MHz | 840 MHz |
Execution units | 6 | No |
Shading units | No | No |
Total shaders | No | No |
FLOPS | No | 26.2 TFLOPS |
Vulkan version | 1.1 | 1.1 |
OpenCL version | 2.0 | 2.0 |
DirectX version | 12.1 | 12.1 |
Memory
The memory specifications such as type, frequency, bus, and bandwidth are crucial for multitasking and handling large applications efficiently. Both SoCs support advanced memory technologies suitable for high-performance requirements.
Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
Memory type | LPDDR5 | LPDDR5 |
Memory frequency | 2750 MHz | 3200 MHz |
Bus | 4x 16-bit | 4x 16-bit |
Max bandwidth | 51.2 GB/s | 51.2 GB/s |
Max size | 16GB | 16GB |
Multimedia (ISP)
Multimedia capabilities include support for various storage types, display and camera resolutions, and codec supports, which are vital for content creation and consumption on mobile devices.
Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
Storage type | UFS 3.1 | UFS 3.1 |
Max display resolution | 2520 x 1080 | 3840 x 2160 |
Max camera resolution | 108 MP | 200 MP |
Video capture | 4K at 60fps | 8K at 30fps |
Video playback | 4K at 60fps | 8K at 30fps |
Video codecs | H.264, H.265, VP9 | H.264, H.265, VP9 |
Audio codecs | AAC, LDAC, LC3 | AAC, aptX, LDAC |
Connectivity and network
Connectivity features determine the SoC's ability to interface with various network standards and technologies. These specifications impact internet speed, communication quality, and overall connectivity experience.
Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
Modem | MediaTek M80 | Snapdragon X60 |
4G support | Yes | Yes |
5G support | Yes | Yes |
Download speed | Up to 4.7 Gbps | Up to 7.5 Gbps |
Upload speed | Up to 2.5 Gbps | Up to 3 Gbps |
Wi-Fi | 6 | 6E |
Bluetooth | 5.3 | 5.2 |
Navigation | GPS, GLONASS, BeiDou, Galileo | GPS, GLONASS, BeiDou, Galileo |
MediaTek Dimensity 8100 vs Qualcomm Snapdragon 888 - Benchmarking
Benchmarks provide a quantitative measure of the SoCs' performance across various tasks, highlighting their strengths and weaknesses. The benchmarks include popular tests like AnTuTu, GeekBench, and 3DMark.
AnTuTu 10
AnTuTu evaluates the overall performance of mobile processors by testing their CPU, GPU, memory, and user experience (UX) aspects. This comprehensive test provides a total score indicating the SoC's efficiency and power.
Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
CPU | 210,000 | 230,000 |
GPU | 290,000 | 320,000 |
Memory | 140,000 | 160,000 |
UX | 120,000 | 150,000 |
Total score | 760,000 | 860,000 |
GeekBench 6
GeekBench tests various components such as asset compression, HTML5 browsing, PDF rendering, and more, providing scores for each test and an overall score for single-core and multi-core performance.
Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
Asset compression | 1300 | 1500 |
HTML 5 browse | 1400 | 1600 |
PDF render | 1200 | 1400 |
Image detection | 1100 | 1300 |
HDR | 1000 | 1200 |
Background blur | 900 | 1100 |
Photo processing | 1000 | 1200 |
Ray tracing | 800 | 1000 |
3DMark
3DMark tests the graphical performance of the SoCs, including stability and graphics tests. The scores indicate how well the SoCs can handle intensive graphical tasks and gaming.
Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
Stability | 98% | 99% |
Graphics test | 9000 | 10000 |
Score | 8500 | 9500 |
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