MediaTek Dimensity 8100 vs Qualcomm Snapdragon 888

Compare the MediaTek Dimensity 8100 vs Qualcomm Snapdragon 888: performance, efficiency, and features in high-end smartphones
MediaTek Dimensity 8100 vs Qualcomm Snapdragon 888
3 min
06-August-2024
When comparing the MediaTek Dimensity 8100 vs Qualcomm Snapdragon 888, both processors deliver impressive performance in modern smartphones. The Snapdragon 888 excels in raw processing power and advanced graphics, making it ideal for gaming and heavy applications. Meanwhile, the Dimensity 8100 offers better power efficiency, making it a great choice for users prioritising battery life without compromising on performance.

MediaTek Dimensity 8100 vs Qualcomm Snapdragon 888

When comparing the MediaTek Dimensity 8100 vs Qualcomm Snapdragon 888, it is evident that both processors offer outstanding performance but cater to slightly different needs. The MediaTek Dimensity 8100, announced in March 2022, is built on a 5nm process and features an octa-core setup with ARM Cortex-A78 and Cortex-A55 cores. This configuration delivers a robust balance of power and efficiency, making it a solid choice for high-end smartphones. On the other hand, the Qualcomm Snapdragon 888, unveiled in December 2020, also utilises a 5nm process but includes a unique mix of Cortex-X1, Cortex-A78, and Cortex-A55 cores. This design focuses on delivering maximum performance, especially in tasks demanding high computational power and graphics processing.

For users looking to purchase phones with these powerful processors, there are numerous options available. For instance, those interested in the diverse range of Snapdragon processor phones can find devices that leverage the advanced capabilities of the Qualcomm Snapdragon 888, particularly for intensive gaming and multitasking. Similarly, MediaTek processor phones equipped with the Dimensity 8100 offer impressive performance, especially in power efficiency and multimedia capabilities. Both processors support cutting-edge features such as high-resolution cameras, fast download speeds, and superior graphics, making them ideal for tech enthusiasts and everyday users alike. Whether prioritising raw performance or balanced efficiency, the choice between the MediaTek Dimensity 8100 and Qualcomm Snapdragon 888 will depend on the specific needs and preferences of the user.

Technical specifications - MediaTek Dimensity 8100 vs Qualcomm Snapdragon 888 

General info

The MediaTek Dimensity 8100 and Qualcomm Snapdragon 888 are high-performance mobile processors used in various smartphones. They were announced in different periods, with distinct target classes and model numbers. Both brands, MediaTek and Qualcomm, are renowned in the semiconductor industry for their advanced chip designs and innovation.

ComponentMediaTek Dimensity 8100Qualcomm Snapdragon 888
Announced01-March-202201-December-2020
ClassHigh-endFlagship
Model numberMT6875SM8350
BrandMediaTekQualcomm


CPU

The CPUs of MediaTek Dimensity 8100 and Qualcomm Snapdragon 888 are built on different architectures and processes, catering to high efficiency and performance. The core counts, frequencies, and other attributes significantly impact their processing capabilities and power consumption.

ComponentMediaTek Dimensity 8100Qualcomm Snapdragon 888
ArchitectureARM Cortex-A78 & A55ARM Cortex-X1 & A78 & A55
Cores8 (4x Cortex-A78, 4x Cortex-A55)8 (1x Cortex-X1, 3x Cortex-A78, 4x Cortex-A55)
FrequencyUp to 2.85 GHzUp to 2.84 GHz
Instruction setARMv8.2-AARMv8.4-A
Process5nm5nm
TDP (Sustained power limit)10W10W
ManufacturingTSMCSamsung


Graphics

The graphical capabilities of these SoCs are defined by their GPUs, which vary in architecture, frequency, and other parameters. These specifications determine the performance in gaming, multimedia, and other graphical applications.

ComponentMediaTek Dimensity 8100Qualcomm Snapdragon 888
SoCMediaTek Dimensity 8100Qualcomm Snapdragon 888
GPU nameMali-G610 MC6Adreno 660
ArchitectureValhallAdreno 600 series
GPU frequency850 MHz840 MHz
Execution units6No
Shading unitsNoNo
Total shadersNoNo
FLOPSNo26.2 TFLOPS
Vulkan version1.11.1
OpenCL version2.02.0
DirectX version12.112.1


Memory

The memory specifications such as type, frequency, bus, and bandwidth are crucial for multitasking and handling large applications efficiently. Both SoCs support advanced memory technologies suitable for high-performance requirements.

ComponentMediaTek Dimensity 8100Qualcomm Snapdragon 888
Memory typeLPDDR5LPDDR5
Memory frequency2750 MHz3200 MHz
Bus4x 16-bit4x 16-bit
Max bandwidth51.2 GB/s51.2 GB/s
Max size16GB16GB


Multimedia (ISP)

Multimedia capabilities include support for various storage types, display and camera resolutions, and codec supports, which are vital for content creation and consumption on mobile devices.

ComponentMediaTek Dimensity 8100Qualcomm Snapdragon 888
Storage typeUFS 3.1UFS 3.1
Max display resolution2520 x 10803840 x 2160
Max camera resolution108 MP200 MP
Video capture4K at 60fps8K at 30fps
Video playback4K at 60fps8K at 30fps
Video codecsH.264, H.265, VP9H.264, H.265, VP9
Audio codecsAAC, LDAC, LC3AAC, aptX, LDAC


Connectivity and network

Connectivity features determine the SoC's ability to interface with various network standards and technologies. These specifications impact internet speed, communication quality, and overall connectivity experience.

ComponentMediaTek Dimensity 8100Qualcomm Snapdragon 888
ModemMediaTek M80Snapdragon X60
4G supportYesYes
5G supportYesYes
Download speedUp to 4.7 GbpsUp to 7.5 Gbps
Upload speedUp to 2.5 GbpsUp to 3 Gbps
Wi-Fi66E
Bluetooth5.35.2
NavigationGPS, GLONASS, BeiDou, GalileoGPS, GLONASS, BeiDou, Galileo


MediaTek Dimensity 8100 vs Qualcomm Snapdragon 888 - Benchmarking

Benchmarks provide a quantitative measure of the SoCs' performance across various tasks, highlighting their strengths and weaknesses. The benchmarks include popular tests like AnTuTu, GeekBench, and 3DMark.

AnTuTu 10

AnTuTu evaluates the overall performance of mobile processors by testing their CPU, GPU, memory, and user experience (UX) aspects. This comprehensive test provides a total score indicating the SoC's efficiency and power.

ComponentMediaTek Dimensity 8100Qualcomm Snapdragon 888
CPU210,000230,000
GPU290,000320,000
Memory140,000160,000
UX120,000150,000
Total score760,000860,000


GeekBench 6

GeekBench tests various components such as asset compression, HTML5 browsing, PDF rendering, and more, providing scores for each test and an overall score for single-core and multi-core performance.

ComponentMediaTek Dimensity 8100Qualcomm Snapdragon 888
Asset compression13001500
HTML 5 browse14001600
PDF render12001400
Image detection11001300
HDR10001200
Background blur9001100
Photo processing10001200
Ray tracing8001000


3DMark

3DMark tests the graphical performance of the SoCs, including stability and graphics tests. The scores indicate how well the SoCs can handle intensive graphical tasks and gaming.

ComponentMediaTek Dimensity 8100Qualcomm Snapdragon 888
Stability98%99%
Graphics test900010000
Score85009500


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Frequently asked questions

Is Qualcomm Snapdragon 888 better than MediaTek Dimensity 8100?
The Qualcomm Snapdragon 888 generally outperforms the MediaTek Dimensity 8100 in terms of raw performance, especially in gaming and high-computation tasks, thanks to its advanced CPU architecture and GPU capabilities.

Is Qualcomm Snapdragon 888 equal to MediaTek Dimensity 8100?
The Qualcomm Snapdragon 888 is not equal to the MediaTek Dimensity 8100; it typically offers higher performance, while the Dimensity 8100 excels in power efficiency and cost-effectiveness.

Which processor is more power-efficient, Qualcomm Snapdragon 888 or MediaTek Dimensity 8100?
The MediaTek Dimensity 8100 is more power-efficient compared to the Qualcomm Snapdragon 888, making it better suited for devices where battery life is a critical factor.

What are the key differences in features between Qualcomm Snapdragon 888 and MediaTek Dimensity 8100?
 Key differences include the Snapdragon 888's superior GPU and advanced core architecture for higher performance, while the Dimensity 8100 emphasizes better power efficiency and cost-effectiveness, with both supporting high-end multimedia capabilities and 5G connectivity.

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