When comparing the MediaTek Dimensity 7050 vs Qualcomm Snapdragon 888, it is clear that both processors cater to different segments of the smartphone market, each bringing unique strengths to the table. The MediaTek Dimensity 7050, announced on 10 May 2023, is designed for mid-range devices, offering a balanced performance with an octa-core architecture that includes two high-performance ARM Cortex-A78 cores and six power-efficient Cortex-A55 cores. It boasts a robust ARM Mali-G57 MC3 GPU, making it a capable option for everyday tasks and moderate gaming. On the other hand, the Qualcomm Snapdragon 888, a flagship processor released on 01 December 2020, is engineered for high-end smartphones. With its tri-cluster CPU configuration featuring the powerful ARM Cortex-X1 core, alongside the efficient Cortex-A78 and Cortex-A55 cores, and the Adreno 660 GPU, it delivers exceptional performance for intensive applications and cutting-edge gaming experiences.
For users seeking premium features and top-tier performance, the Qualcomm Snapdragon 888 is a clear winner. It supports advanced connectivity options like Wi-Fi 6E and Bluetooth 5.2, and its X60 5G modem ensures blazing-fast download and upload speeds. Additionally, its multimedia capabilities, including support for 8K video capture and playback, cater to power users and tech enthusiasts. Meanwhile, the MediaTek Dimensity 7050 remains a compelling choice for those who need a reliable processor without breaking the bank. It provides excellent value with solid performance, 5G connectivity, and support for high-resolution cameras and displays. To explore devices featuring these processors, check out the latest
Snapdragon processor phones and
MediaTek processor phones available on the market.
Technical specifications - MediaTek Dimensity 7050 vs Qualcomm Snapdragon 888
General info
The MediaTek Dimensity 7050 and Qualcomm Snapdragon 888 are prominent mobile processors. The Dimensity 7050 was announced on 10 May 2023, and the Snapdragon 888 was announced on 01 December 2020. The Dimensity 7050 falls under the mid-range class, while the Snapdragon 888 belongs to the flagship class. The model number for the Dimensity 7050 is MT6877V, and for the Snapdragon 888, it is SM8350. Both chips are renowned brands, with MediaTek and Qualcomm leading the industry.
| Component | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 |
| Announced | 10 May 2023 | 01 December 2020 |
| Class | Mid-range | Flagship |
| Model number | MT6877V | SM8350 |
| Brand | MediaTek | Qualcomm |
CPU
The CPU architecture significantly impacts a processor's performance. The MediaTek Dimensity 7050 features an octa-core architecture, including two ARM Cortex-A78 cores at 2.6 GHz and six ARM Cortex-A55 cores at 2.0 GHz. It uses a 6nm manufacturing process. The Snapdragon 888, on the other hand, features a tri-cluster architecture with one ARM Cortex-X1 core at 2.84 GHz, three ARM Cortex-A78 cores at 2.42 GHz, and four ARM Cortex-A55 cores at 1.8 GHz. It employs a 5nm process, enhancing energy efficiency and performance.
| Component | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 |
| Architecture | ARM Cortex-A78 and Cortex-A55 | ARM Cortex-X1, Cortex-A78, Cortex-A55 |
| Cores | 8 | 8 |
| Frequency | 2.6 GHz (A78), 2.0 GHz (A55) | 2.84 GHz (X1), 2.42 GHz (A78), 1.8 GHz (A55) |
| Instruction set | ARMv8.2-A | ARMv8.4-A |
| Process | 6nm | 5nm |
| TDP (Sustained power limit) | 6W | 10W |
| Manufacturing | TSMC | Samsung |
Graphics
Graphics performance is crucial for gaming and multimedia. The Dimensity 7050 integrates the ARM Mali-G57 MC3 GPU, while the Snapdragon 888 uses the Adreno 660 GPU. The Mali-G57 operates at 850 MHz, featuring three execution units and 144 shading units. The Adreno 660 runs at 840 MHz with enhanced graphical capabilities, boasting 512 ALUs. Both GPUs support the latest graphics APIs, including Vulkan 1.1 for the Dimensity 7050 and Vulkan 1.2 for the Snapdragon 888.
| Component | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 |
| SoC | Dimensity 7050 | Snapdragon 888 |
| GPU name | ARM Mali-G57 MC3 | Adreno 660 |
| Architecture | Bifrost | Adreno |
| GPU frequency | 850 MHz | 840 MHz |
| Execution units | 3 | NA |
| Shading units | 144 | 512 ALUs |
| Total shaders | 144 | 512 |
| FLOPS | 1.3 TFLOPS | 10.5 TFLOPS |
| Vulkan version | 1.1 | 1.2 |
| OpenCL version | 2.0 | 2.0 |
| DirectX version | 12 | 12 |
Memory
Memory specifications determine data handling capabilities. The Dimensity 7050 supports LPDDR4X memory at 2133 MHz, with a 2x16-bit bus configuration and a maximum bandwidth of 17 GB/s. It supports up to 12 GB of RAM. The Snapdragon 888 supports LPDDR5 memory at 3200 MHz and LPDDR4X at 2133 MHz, with a 4x16-bit bus configuration and a maximum bandwidth of 51.2 GB/s, supporting up to 16 GB of RAM.
| Component | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 |
| Memory type | LPDDR4X | LPDDR5, LPDDR4X |
| Memory frequency | 2133 MHz | 3200 MHz (LPDDR5), 2133 MHz (LPDDR4X) |
| Bus | 2x16-bit | 4x16-bit |
| Max bandwidth | 17 GB/s | 51.2 GB/s |
| Max size | 12GB | 16GB |
Multimedia (ISP)
Multimedia capabilities define the user experience in photography and videography. The Dimensity 7050 supports UFS 2.2 storage, a maximum display resolution of 2520x1080 pixels, and a camera resolution of up to 108 MP. It supports 4K video capture and playback at 30fps. The Snapdragon 888 supports UFS 3.1 storage, a display resolution of up to 4K, and a camera resolution of up to 200 MP. It supports 8K video capture at 30fps and 4K at 120fps, along with advanced video and audio codecs.
| Component | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 |
| Storage type | UFS 2.2 | UFS 3.1 |
| Max display resolution | 2520x1080 | 4K |
| Max camera resolution | 108 MP | 200 MP |
| Video capture | 4K @ 30fps | 8K @ 30fps, 4K @ 120fps |
| Video playback | 4K @ 30fps | 8K @ 30fps, 4K @ 120fps |
| Video codecs | H.264, H.265/HEVC | H.264, H.265/HEVC, VP9 |
| Audio codecs | AAC, MP3, aptX | AAC, MP3, aptX, LDAC |
Connectivity and network
Connectivity options enhance the usability of mobile devices. The Dimensity 7050 includes an integrated 5G modem, supporting 4G and 5G networks with download speeds up to 2.77 Gbps and upload speeds up to 1.25 Gbps. It supports Wi-Fi 5 and Bluetooth 5.1. The Snapdragon 888 features the X60 5G modem, supporting 4G and 5G with download speeds up to 7.5 Gbps and upload speeds up to 3 Gbps. It supports Wi-Fi 6E and Bluetooth 5.2, providing enhanced connectivity and navigation features.
| Component | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 |
| Modem | Integrated 5G | X60 5G |
| 4G support | Yes | Yes |
| 5G support | Yes | Yes |
| Download speed | 2.77 Gbps | 7.5 Gbps |
| Upload speed | 1.25 Gbps | 3 Gbps |
| Wi-Fi | 5 | 6E |
| Bluetooth | 5.1 | 5.2 |
| Navigation | GPS, GLONASS, Beidou | GPS, GLONASS, Beidou, Galileo |
MediaTek Dimensity 7050 vs Qualcomm Snapdragon 888 - Benchmarking
Benchmark scores offer insight into real-world performance. The MediaTek Dimensity 7050 and Qualcomm Snapdragon 888 have been tested across various benchmarks, revealing distinct performance profiles. AnTuTu 10, GeekBench 6, and 3DMark are popular benchmarks used to evaluate these processors. Each test measures different aspects, such as CPU, GPU, memory, and overall user experience (UX). The Snapdragon 888 typically outperforms the Dimensity 7050, reflecting its flagship status and advanced technological features.
AnTuTu 10
AnTuTu 10 is a comprehensive benchmark covering CPU, GPU, memory, and UX. The MediaTek Dimensity 7050 scores around 500,000, with strong performance in CPU and memory tests. The Qualcomm Snapdragon 888 scores significantly higher, at around 800,000, excelling in GPU and UX components due to its advanced architecture and higher clock speeds. These scores highlight the Snapdragon 888’s superiority in handling demanding applications and gaming scenarios.
| Component | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 |
| CPU | 150,000 | 230,000 |
| GPU | 130,000 | 310,000 |
| Memory | 90,000 | 140,000 |
| UX | 130,000 | 120,000 |
| Total score | 500,000 | 800,000 |
GeekBench 6
GeekBench 6 assesses single-core and multi-core performance. The Dimensity 7050 scores around 700 in single-core and 2500 in multi-core tests. The Snapdragon 888 scores significantly higher, around 1100 in single-core and 3700 in multi-core. These scores reflect the Snapdragon 888’s enhanced core design and superior performance in tasks involving image detection, asset compression, and photo processing, making it more suitable for intensive applications.
| Component | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 |
| Asset compression | 600 | 900 |
| HTML 5 browse | 650 | 1050 |
| PDF render | 550 | 1000 |
| Image detection | 700 | 1100 |
| HDR | 500 | 950 |
| Background blur | 400 | 850 |
| Photo processing | 500 | 900 |
| Ray tracing | No | Yes |
3DMark
3DMark evaluates graphics performance, crucial for gaming and 3D applications. The Dimensity 7050 achieves a stability score of 95% with a graphics test score around 3500. The Snapdragon 888 scores higher, with a stability score of 98% and a graphics test score around 8500. These results demonstrate the Snapdragon 888’s superior graphical processing capabilities, making it ideal for high-end gaming and graphic-intensive applications.
| Component | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 |
| Stability | 95% | 98% |
| Graphics test | 3500 | 8500 |
| Score | 3500 | 8500 |
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